PCB Design

PCB Design & Layout for Manufacture

Production-ready PCB layout with signal integrity, power integrity, EMC, and DFM/DFT in mind. From rapid prototypes to scalable, panelized boards ready for assembly.

Talk to an Engineer

What You Get

  • Clean, Manufacturable Layout — correct clearances, apertures, and assembly-friendly placement.
  • Signal & Power Integrity — impedance control, return paths, stitching vias, decoupling strategy.
  • EMC-Conscious Routing — zoning, filtering, shielding, edge rates, and loop-area reduction.
  • Documentation & Outputs — Gerbers/ODB++, drill maps, fab notes, stackup, assembly drawings, pick-and-place, BOM.
  • Panelization & Test — break-off tabs, tooling holes, fiducials, test points, bed-of-nails coverage.

Capabilities

  • Tools: Altium Designer, KiCad, OrCAD
  • Boards: 2–12+ layers, controlled impedance, HDI, blind/buried vias
  • High-speed: USB HS/FS, RMII/RGMII, SDIO, DDR basics, LVDS, MIPI (routing best-practice)
  • RF/Wireless: antenna keep-outs, grounding, match networks (Wi-Fi/BLE/LoRa/sub-GHz)
  • Power: low-noise analog, high-current planes, thermal relief and copper pours
  • Mechanical: 3D step alignment, keep-ins/keep-outs, connector & fastener planning
  • DFM/DFT: assembly constraints, test points, ICT/FCT fixtures
  • Compliance: creepage/clearance, ESD/EMI mitigation, safety markings
  • Outputs: fab & assembly packs, AVL linkage, variant support
  • Support: proto bring-up, revisions, cost-down iterations

Selected Projects

Compact IoT sensor PCB layout

IoT Sensor — compact 4-layer board with BLE, sensors, and coin-cell power domaining.

High current motor driver PCB

Motor Driver — high-current planes, thermal vias, current sense & protection features.

Gateway PCB with Wi-Fi and Ethernet

IoT Gateway — Wi-Fi + Ethernet, controlled impedance pairs, panelized for volume build.

Browse more projects →

Our Process

  • Stackup & Rules — define materials, impedances, design rules with the fab.
  • Placement — functional zoning, thermal/EMC planning, connectors & mechanics.
  • Routing — high-speed pairs, power distribution, shielding & stitching strategies.
  • Review — DRC/ERC checks, SI/PI sanity checks, peer review, prototype readiness.
  • Outputs & Handover — fabrication & assembly packs, panelization, test plan.

Need help with PCB design?

We can clean up an existing layout, design a new board, or prepare full fab & assembly packs for production.

Contact Us